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[BRM-A] / Blocky Series Micron Diamond Powder

[BRM-A] / Blocky Series Micron Diamond Powder
[BRM-B] Sharpened Series Micron Diamond Powder

[BRM-B] Sharpened Series Micron Diamond Powder
[BRM-GC] High Purity Micron Diamond Powder

[BRM-GC] High Purity Micron Diamond Powder
[BRM-GQ] High Strength Micron Diamond Powder

[BRM-GQ] High Strength Micron Diamond Powder
[BRM-WSD] Micron Diamond Powder for Diamond Wire

[BRM-WSD] Micron Diamond Powder for Diamond Wire
[BRM-PCD] Micron Diamond Powder for PCD Synthesis

[BRM-PCD] Micron Diamond Powder for PCD Synthesis
[BRM-Z] Reshaped Mesh Diamond Powder

[BRM-Z] Reshaped Mesh Diamond Powder
[BRM-P] Crushed Mesh Diamond Powder

[BRM-P] Crushed Mesh Diamond Powder
[BRM-E] Green Crushed Mesh Diamond

[BRM-E] Green Crushed Mesh Diamond
Metal Bond Diamond

Metal Bond Diamond
0102030405
Cluster Diamond BRM-S
Cluster Diamond BRM-S
Cluster Diamond BRM-S
Cluster Diamond BRM-S
Cluster Diamond BRM-S
Cluster Diamond BRM-S
Cluster Diamond BRM-S
Cluster Diamond BRM-S
Cluster Diamond BRM-S
Cluster Diamond BRM-S

Cluster Diamond BRM-S

• Particles of around 30μm spherical polycrystalline particles have the strongest wear resistance and compressive strength for grinding liquids. The polishing pad is more suitable for polycrystalline particles of around 60μm.
• The surface of cluster diamond particles exposes diamond, with diamond edges and corners exposed, providing the strongest grinding force;
• The cluster diamond particles peel off layer by layer during the grinding process, with inner layers taking over, ensuring stable grinding force throughout.

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    product details

    Cluster Diamond Description


    Sapphire thin slices

    conventional processing

    New processing

    technology for

    sapphire thin slices

    Zirconia ceramic grinding and processing technology

    Process flow

    Growing crystals—cutting bars—slicing—

    double-sided grinding—single-sided

    grinding—CMP fine polishing—cleaning

    Growing crystals—cutting

    bars—slicing—double-sided

    grinding—CMP fine

    polishing—cleaning

    Dry pressing/injection molding—

    Degreasing sintering—CNC carving—

    Grinding—Rough polishing—CMP fine

    polishing—Cleaning

    Polishing

    process/

    consumables

    Double side polishing

    Single side polishing

    Double side polishing

    Single side polishing

    Surface polishing

    Cast iron plate +

    boron carbide grinding

    fluid

    Copper disc +

    diamond grinding

    fluid

    Resin polishing pad +

    polycrystalline diamond

    polishing fluid

    Resin polishing pad

    + polycrystalline

    diamond polishing

    fluid

    Profiled copperhead

    + polycrystalline

    diamond grinding

    fluid

    SEM of Cluster Diamond Powder

    • product-description1d3y
    • product-description2jub
    • Particles of around 30μm spherical polycrystalline particles have the strongest wear resistance and compressive strength for grinding liquids. The polishing pad is more suitable for polycrystalline particles of around 60μm.
    • The surface of cluster diamond particles exposes diamond, with diamond edges and corners exposed, providing the strongest grinding force;
    • The cluster diamond particles peel off layer by layer during the grinding process, with inner layers taking over, ensuring stable grinding force throughout.

    The physical and chemical properties of cluster diamond polishing liquid / pad

    Brand

    Grain Size

    D50

    Content

    PH Value

    Viscosity

    BRM0309

    3.0μm

    30μm

    1%

    7.5

    35mPa.S

    BRM0159

    1.5μm

    35μm

    1%

    7.5

    35mPa.S

    Comparing 3μm cluster diamond with others

    • product-description3ium

      BRM0159 Cluster Diamond

    • product-description4hvu

      General Polycrystalline Diamond

    • product-description5sam

      General Monocrystalline Diamond

    • BRM0159 is approximately spherical, containing diamond micro-powder. Its surface has more angular contact points during grinding, leading to a faster grinding rate;
    • The presence of fine powder in cluster diamond is 3μm, with smaller angular cutting edges, resulting in a better surface finish after grinding.

    Conclusion

    • Compared with similar competing products on the market, BRM0309 has a higher and more stable grinding rate, and provides a better surface finish after grinding.
    • Compared with the American 3μm product, BRM0159 has a similar grinding rate and surface finish after grinding. However, it has a more abundant supply source, ensuring continuous availability.

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