I-Nickel-Coated Diamond Powder (I-Chemical Plated)

2024-03-27 09:46:25

I-Diamond micro-powder electroless nickel plating iwubuchwepheshe obusebenzayo bakuqala kakhulu, ekuqaleni obubizwa ngokuthi i-diamond metallization plating, i-diamond micro-powder electroless nickel plating ilingana nempuphu encane yedayimane egqoke ijazi elimnyama ( Ijazi lempushana yedayimane elimnyama ), lapho idayimane icwecwe. isetshenziselwa kakhulu amathuluzi edayimane, isondo lokugaya idayimane eliyinhlanganisela yokuhlanganisa, ukuze kuthuthukiswe amandla okubamba idayimane nethuluzi, i-abrasive substrate (siyibiza ngokuthi amandla okubopha). Inqubo yamanje ngokuyisisekelo ilandela inqubo yendabuko ( ukususwa kwamafutha - i-coarsening - sensitization - activation palladium - electrolysis nickel plating ).

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Kusukela ngo-2015, ngemboni ye-photovoltaic inani elikhulu lokukhuthazwa kanye nokusetshenziswa kwe-diamond wire saw ukuze kuthathelwe indawo udaka lwendabuko + lwensimbi yensimbi yokusika impahla ye-silicon, ucingo lwedayimane lwabona njengomkhiqizo oqhelelene, ngokuzumayo lwashisa, imboni ehlobene ne-photovoltaic iphinda iveze. ukuthi i-diamond wire yamanje yabona inani lomkhiqizo wemakethe lingaba amashumi ezigidigidi ze-RMB ngonyaka, okuletha ukuthuthukiswa kwemboni ye-diamond wire saw wire okuqhubekayo, njengoba impahla eyinhloko yesaha yedayimane yocingo - I-Synthetic Diamond Powder, i-diamond powder nickel plating nayo ephelezelwa le tuyere, eminyakeni yamuva isibe ukuthuthukiswa okusheshayo kwezobuchwepheshe.

Idayimane Nempushana Yedayimane: Idayimane elishiwo lapha liyikristalu yedayimane yokwenziwa, ekhiqizwa ngokuzenzela yi-graphite kanye ne-catalyst ekubunjweni komshini wokucindezela we-hexahedral ophezulu ekushiseni okuphezulu nokucindezela okuphezulu. Ukuminyana kungu-3.5 g/cm3, futhi kunezinto ezibonakalayo namakhemikhali edayimane lemvelo. Yizinto ezinobunzima obuphakeme kakhulu njengamanje, futhi imvamisa isetshenziselwa ukukhiqizwa kwamathuluzi okuqina okuphezulu nama-abrasives. Ngemuva kokuchotshozwa, ukuhlunga usayizi wezinhlayiyana kanye nokuhlukaniswa komumo, ikristalu yedayimane yokwenziwa isetshenziswa njengokucaciswa okunqunyiwe kwempuphu yedayimane yesaha yocingo lwedayimane. Njengamanje, usayizi wezinhlayiyana ovamile usuka kuma-microns angu-5 kuya kuma-microns angu-50, futhi izinga lokuhlukanisa lilinganiselwa ku-5 - 10, 8 - 12, 10 - 20, 20 - 30, 30 - 40, 40 - 50 ... (iyunithi i-micron). Ukulandela imodi yokusebenzisa idayimane elinosayizi omkhulu kulayini omahhadla kanye nedayimane elincane eliwusayizi wezinhlayiyana emgqeni omuhle, ngo-2015, ububanzi obuncane bokukhiqizwa okukhulu kwebhasi lesaha ledayimane selifinyelele kuma-microns angu-50 ( izintambo ezi-5), okuyinto isetshenziselwa ukusika izinto ze-silicon. Ubuncane bebhasi bedayimitha yesaha yedayimane yokusika uzibuthe ongapheli emhlabeni ngama-microns angu-120 (izintambo eziyi-12).

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Izici ze-electroless nickel plating kumpushana wedayimane:Insimbi yokunameka ingathuthukisa ukuchithwa kokushisa futhi inciphise ukulimala okushisayo ukuze kuvikelwe idayimane (ukunciphisa i-carbonization yedayimane ngesikhathi sokushiswa kwezinga lokushisa eliphakeme kakhulu) ukuze ubuso bezinhlayiya zedayimane bube nzima kanye nokugcinwa komshini phakathi kwedayimane. izinhlayiya zithuthukiswa;