BRM-PD-Series

Nta:

◆ Ntau dua toughness thiab zoo dua selfsharpening zog piv nrog monocrystalline pob zeb diamond.

◆ Kev tshem tawm ntau dua, khawb tsawg dua, kev ua haujlwm polishing zoo dua piv nrog cov pob zeb diamond monocrystalline.

◆ High hnav tsis kam thiab ua haujlwm ntev.

Tiv tauj peb

cov khoom paub meej

BRM-PD-Series

Cov yam ntxwv ntawm polycrystalline pob zeb diamond hmoov:

(1) Cov crystals yog teem nyob rau hauv tsis sib xws, yog li lub hardness yog uniform thiab tsis-directional;

(2) muaj lub zog siab, tshwj xeeb tshaj yog cuam tshuam lub zog thiab hnav tsis kam;

(3) tuaj yeem ua rau cov duab tshwj xeeb;

(4) Kev ua tau zoo ntawm cov khoom lag luam tuaj yeem tsim lossis kwv yees kom muab cov yam ntxwv tsim nyog kom haum rau nws cov kev siv tshwj xeeb;

Daim ntawv thov

1. Nto polishing ntawm ntau yam ceramics;

2. Daim ntawv thov nyob rau hauv lub tshav pob ntawm high-end semiconductor cov ntaub ntawv;

3. Siv los ua cov khoom siv encapsulation thiab sib nqus kaw lus rau IT khoom;

4. Lapping thiab polishing ntawm semiconductor wafers xws li SiC thiab sapphire wafers;

5. Siv los ua cov roj nplua nyeem lossis roj ntxiv, nws tuaj yeem txhim kho kev ua haujlwm ntawm cov tshuab thiab tsheb, txo qhov ua yuam kev thiab txuas ntxiv lub neej kev pabcuam.

Nanocrystalline pob zeb diamond tuaj yeem hloov tau ib lub pob zeb diamond hauv cov roj av drilling, precision hlau kos duab thiab cov cuab yeej kho qhov muag.

Specification	D10 (μm)	D50 (m)	D90 (m)
PWM-PD 0-1	≥0.05	0.40-0.60 Nws	≤ 1.00
PWM-PD 0-2	≥0.05	0.90-1.10 Nws	≤ 2.00
PIB 1-3	≥1.00 Nws	1.90-2.10 Nws	≤ 3.00
PIB 2-4	≥ 2.00 Nws	2.90-3.10 Nws	≤ 4.00
PIB 2-5	≥ 2.00 Nws	3.40-3.60 Nws	≤ 5.00
PWM-PD 3-6	≥3.00 Nws	4.40-4.60 Nws	≤ 6.00
PIB 4-8	≥4.00 Nws	5.90-6.10 Nws	≤ 8.00 Nws
PIB 5-10	≥5.00 Nws	7.40-7.60 Nws	≤ 10.00 Nws
PIB 6-12	≥6.00 Nws	8.90-9.10 Nws	≤ 12.00 Nws