Hui Diamond BRM-S
Cluster Diamond Description
Nā ʻāpana lahilahi Sapphire hana maʻamau | Hana hou ʻenehana no nā ʻāpana lahilahi sapphire | Zirconia ceramic grinding and processing technology | |||
Kaʻina hana | Ke ulu nei i nā kristal—ʻoki ʻoki—ʻokiʻoki— wili ʻaoʻao ʻelua—ʻaoʻao hoʻokahi wili—CMP maikaʻi polū—hoʻomaʻemaʻe | Ke ulu nei i nā kristal—ʻoki bars—slicing—ʻaoʻao ʻelua wili—CMP maikai poni—hoomaemae | ʻO ke kaomi maloʻo/hoʻoheheʻe ʻia— Degreasing sintering—CNC kalai— ʻO ka wili ʻana—Pila ʻala—CMP maikaʻi poni—Hoomaemae | ||
ʻO ka hoʻopololei kaʻina hana/ mea hoopau | Poni ʻaoʻao pālua | ʻO ka poni ʻaoʻao hoʻokahi | Poni ʻaoʻao pālua | ʻO ka poni ʻaoʻao hoʻokahi | Ka poni ʻili |
Papa hao + wili boron carbide wai wai | Kōpae keleawe + wili daimana wai wai | ʻO ka paʻi poni resin + daimana polycrystalline wai poni | Paʻa poni resin + polycrystalline ka poni daimana wai wai | ʻO ke poʻo keleawe i hoʻopaʻa ʻia + polycrystalline wili daimana wai wai |
SEM o Cluster Diamond Powder
ʻO nā waiwai kino a me nā kemika o ka cluster daimana polishing wai / pad
Brand | Ka nui o ka palaoa | D50 | Maʻiʻo | Waiwai PH | ʻO ka viscosity |
BRM0309 | 3.0μm | 30μm | 1% | 7.5 | 35mPa.S |
BRM0159 | 1.5μm | 35μm | 1% | 7.5 | 35mPa.S |
Ka hoʻohālikelike ʻana i nā daimana puʻupuʻu 3μm me nā mea ʻē aʻe
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BRM0159 Cluster Diamond
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Daimana Policrystalline Nui
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General Monocrystalline Diamond